Bonding of sputtering targets
We use four different methods
FHR has more than 25 years of experience bonding sputtering targets. Bonding is the joining of target material and heat sink or back plate using a connecting material. With the four bonding technologies we use, we cover the entire range of sputtering target joining techniques in-house: Metallic bonding, elastomer bonding, epoxy bonding and nano bonding.
Bonding to the back plate or heat sink allows the use of target materials which, because of their mechanical properties, their low heat conduction, their composition from different segments or simply their material price, could otherwise only be sputtered with restrictions or not at all.