Epoxy bonding

Bonding with epoxy resins

The connection is made by special 1- or 2-component epoxy resins. These contain fillers if necessary, for example, to adjust the mechanical properties, to improve the thermal conductivity and to achieve the required electrical conductivity. Depending on the epoxy resin system, the joining process can be done entirely at room temperature, so that there are no mechanical stresses, which are caused by different thermal expansion coefficients between the target and backplate at elevated temperatures, in the target assembly after joining.

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Special properties of epoxy bonding

  • Thermal resistance is comparable to, or higher than, most metallic soft solders
  • Electrical conductivity is dependent on the additives - from insulating to highly conductive

Coating materials

All materials, sizes and shapes, optionally bonded