Microelectronics of the future

More than two decades ago, microelectronics became part of everyday life with personal computers and the Internet. Ever since then we have been witnessing rapid technological advancements in computer technology, with a corresponding change in our overall living conditions. But that's not all: Technologies such as self-driving cars, artificial intelligence, quantum computers and the Internet of Things are expected to take centre stage in the near future. In addition to developing software for these future technologies, the hardware will also need to be developed, and of course, the systems to produce it.

The system is used for microelectronics research and development so it needs to be prepared to meet all present and future requirements. Accordingly, the system needs to be able to handle practically any combination possible in sputtering systems:
Suitable for wafers up to 200 mm in diameter, the time from substrate insertion to the start of the process is short, the surface is activated or etched by ion bombardment, the substrate can be heated up to 600 °C, DC and RF bias of the substrate, up to 5 sputtering targets allowing different target materials to be sputtered individually or simultaneously by co-sputtering in both DC and RF modes whether direct or reactive. The angle of the target and the target-to-substrate distance also need to be adjustable and, of course, the system should take up only minimal space for installation in the clean room. Finally, the system needs to be able to complete complex recipes automatically, continuously record all process data and allow for different user levels.