Thin film technology

Thin film technologies are processes for depositing and processing thin layers from a few microns thick down to individual atomic layers. The materials used as the substrate and the applications vary widely and we are surrounded by them in our everyday lives: Processors and memory chips on silicon wafers for modern microelectronics, hard coatings on drill bits, decorative iridescent layers on gemstones, anti-reflective coatings on glasses, antibacterial metal coatings on medical devices, flexible solar cells or even coatings for food packaging and medicines on miles of foil.

To be able to deposit such thin layers with well-defined characteristics, the atoms and molecules that form a layer are usually collected from the gas phase at very low pressure (vacuum) so that the concentrations can be closely controlled, as can the rate at which layers build up. When the layer is formed by condensation or re-sublimation, the process is called physical vapour deposition (PVD). On the other hand, when a layer is formed through chemical reactions, it is called chemical vapour deposition (CVD). In addition to the coating materials and the used method, there are many parameters that can potentially affect the final characteristics of the coating, such as the substrate temperature, the energy of the impinging particles or the chemical bonds present on the surface of the substrate.

Thin film technologies also include methods for modifying, masking and removing the coatings. We would be more than happy to offer advice on choosing the appropriate physical and chemical conditions for your particular application as well as conditions specific to your production facility.