Bonding with elastomer materials
Bonding material is an elastomer that can contain optional additives to achieve the required electrical conductivity. The joining process can be done at room temperature, so that there are no mechanical stresses, which are caused by different thermal expansion coefficients between the target and backplate at elevated temperatures, in the sputtering target assembly after joining. The bonding method is suitable for sputtering target assemblies that are subjected to powerful mechanical forces.
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Special properties of elastomer bonding
- Good ductility of the elastomer to compensate for mechanical stresses
- Low/lower thermal conductivity
- Electrical conductivity is adjustable through additives - from insulating to highly conductive