Bonding with epoxy resins
The connection is made by special 1- or 2-component epoxy resins. These resins contain fillers if necessary, for example, to adjust the mechanical properties, to improve the thermal conductivity and to achieve the required electrical conductivity. Depending on the epoxy resin system, the joining process can be done entirely at room temperature, so that there are no mechanical stresses, which are caused by different thermal expansion coefficients between the target and backplate at elevated temperatures, in the target assembly after joining.
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Special properties of epoxy bonding
- Thermal durability is comparable to, or higher than, most metallic soft solders
- Electrical conductivity adjustable through additives - from insulating to highly conductive