You Have Questions?

For personal information, please use the following contact form or give us a call.

Project Case

MEMS & Batteries

ALD coating system on 300 mm wafers for miniaturized complex systems


Great decisions are based on plenty of data. Energy self-sufficient sensor networks with evaluation logic and wireless communication at a low price can improve decisions in many areas. They can localize smoke and toxic gases in rooms, measure nutrient requirements in fields and prevent over-fertilization, monitor water quality with regard to environmental toxins or germs, carry out medical examinations or deliver doses of medication inside the body. This is just a selection of the possible applications.


The system will be used to develop highly integrated components that combine sensors, actuators, data processing, energy storage and wireless communication in a very small space. Atomic layer deposition (ALD) is ideal for high integration density, as it allows not only 2D but also 3D structures – such as trenches or upright cylinders to be coated evenly from all sides on a microscopic level. The system will be used for development and sample production on an industrial scale, and will, therefore, be able to accept and coat batches of 300 mm wafers via a standardized FOUB interface. Simultaneously, as a development system, it must also be able to process undesirable materials such as lithium, gold or copper in CMOS processes, offer a wide range of ALD processes (plasma ALD and thermal ALD in crossflow and showerhead reactors) and be modified by the user or manufacturer at a later date for new research projects. After all, the system must be able to complete complex formulas automatically, continuously record all process data and enable different user levels.


FHR.Star.300-ALD is a cluster system for 300 mm wafers. The wafers are removed from a standardized wafer cassette via a FOUB interface and transported into the vacuum lock. The vacuum system’s central chamber is equipped with a robot that removes the wafers from the airlock and transports them to one of the two process chambers: a plasma ALD chamber and a chamber for thermal ALD. The thermal ALD chamber can be fitted with either a “showerhead” or a “crossflow” reactor. The gas and precursor cabinets in the chambers provide space for a variety of gases and precursors. As is usual with FHR systems, this system possesses comprehensive automation with access to all components and convenient formula control. 


  1. Processing on standard large-scale 300 mm wafers
  2. Allows plasma ALD and thermal ALD (two reactor types)
  3. Flexibility of an R&D facility
  4. Installation in the clean room
  5. Formula-controlled coating with monitoring of all system components and process data logging
Ihr Ansprechpartner

Your Contact Person

Do you have any questions?

Would you like to know more about our FHR.Star product range? Our expert, Matthias Rödl, will be happy to help you. Get in touch with us.